30 Speakers Highlight AI, Memory, Sustainability, and More at the May 21-22 Summit!

SNIA Compute, Memory, and Storage Summit is where solutions, architectures, and community come together. Our 2024 Summit – taking place virtually on May 21-22, 2024 – is the best example to date, featuring a stellar lineup of 30 speakers in sessions on artificial intelligence, the future of memory, sustainability, critical storage security issues, the latest on CXL®, UCIe™, and Ultra Ethernet, and more.

“We’re excited to welcome executives, architects, developers, implementers, and users to our 12th annual Summit,” said David McIntyre, Compute, Memory, and Storage Summit Chair and member of the SNIA Board of Directors. “Our event features technology leaders from companies like Dell, IBM, Intel, Meta, Samsung – and many more – to bring us the latest developments in AI, compute, memory, storage, and security in our free online event.  We hope you will attend live to ask questions of our experts as they present and watch those you miss on-demand.“

Artificial intelligence sessions sponsored by the SNIA Data, Networking & Storage Forum feature J Michel Metz of the Ultra Ethernet Consortium

(UEC) on powering AI’s future with the UEC,  John Cardente of Dell on storage requirements for AI, Jeff White of Dell on edgenuity, and Garima Desai of Samsung on creating a sustainable semiconductor industry for the AI era. Other AI sessions include Manoj Wadekar of Meta on the evolution of hyperscale data centers from CPU centric to GPU accelerated AI, Paul McLeod of Supermicro on storage architecture optimized for AI, and Prasad Venkatachar of Pliops on generative AI data architecture.

Memory sessions begin with Jim Handy and Tom Coughlin on how memories are driving big architectural changes. Ahmed Medhioub of Astera Labs will discuss breaking through the memory wall with CXL, and Sudhir Balasubramanian and Arvind Jagannath of VMware will share their memory vision for real world applications.

Compute sessions include Andy Walls of IBM on computational storage and real time ransomware detection, JB Baker of ScaleFlux on computational storage real world deployments, Dominic Manno of Los Alamos National Labs on streamlining scientific workflows in computational storage, and Bill Martin and Jason Molgaard of the SNIA Computational Storage Technical Work Group on computational storage standards.

CXL will be featured with a CXL Consortium panel on increasing AI and HPC application performance with CXL fabrics, a presentation from Larrie Carr of Rambus on  proprietary internconnects and CXL, and a session from Samsung and Broadcom on bringing unique customer value with CXL accelerator-based memory solutions.

Richelle Ahlvers and Brian Rea of the UCI Express will discuss enabling an open chipset system with UCIe.

The Summit will also dive into security with a number of presentations on this important topic.

And there is much more, including a memory Birds-of-a-Feather session, a live Memory Workshop and Hackathon featuring CXL exercises, and opportunities to chat with our experts! Check out the agenda and register for free!

Just What is an IOTTA?  Inquiring Minds Learn Now!

SNIA’s twelve Technical Work Groups collaborate to develop and promote vendor-neutral architectures, standards, and education for management, movement, and security for technologies related to handling and optimizing data. One of the more unique work groups is the  SNIA Input/Output Traces, Tools, and Analysis Technical Work Group (IOTTA TWG).

SNIA Compute, Memory, and Storage Initiative recently sat down with IOTTA TWG Chairs Geoff Kuenning of Harvey Mudd College and Tom West of hyperI/O LLC to learn about some exciting new developments in their work activities and how SNIA members and colleagues can get involved.

Q: What does the IOTTA TWG do?

A: The IOTTA TWG is for those interested in the use of empirical data/metrics to better understand the actual operation and performance characteristics of storage I/O, especially as they pertain to application workloads. We summarize our work in this SNIA video https://www.youtube.com/watch?v=4EVW5IHHhEk

One of our most important activities is to sponsor a collaborative worldwide repository for storage-related I/O trace collection and analysis tools, application workloads, I/O traces, and best practices around such topics.

Q: What are the goals of the IOTTA Repository collaboration?

A: The primary goal of the IOTTA Repository collaboration is to create a worldwide repository for storage related I/O trace files, associated tools, and other related information, all of which are made available free of charge to the storage research and development communities in both academia and industry.

Repository data is often cited in research publications, with 627 citations to date listed on the IOTTA Repository website.

Q: Why is keeping and sharing information by way of a Repository important?

A: The IOTTA Repository provides a common facility through which a broad community (including storage vendors, storage users, and the academic community) can avail themselves of a variety of storage related I/O traces (especially contemporary I/O traces). We like to think of it as a “One-Stop-Shop”.

Q: What kind of information are you gathering for the Repository?  Is some information more important than other(s)?

A: The Repository contains a wide variety of storage related I/O trace types, including Block I/O, HPC Summaries, Key-Value Traces, NFS Traces, Parallel Traces, Static Snapshots, System Call Traces, and Workload Summaries.

Reliability Traces are the latest category of traces added to the IOTTA Repository. Generally, the Reliability Traces category includes records of storage system reliability, for example, long-term records of hard-drive failures.

The IOTTA Repository additionally provides an off-site link to traces that cannot be included directly within the repository (e.g., unable to obtain permission to host a particular trace within the repository).

Q: Who downloads this information? What groups can make use of this information?

A: Academic institutions are among the most frequent downloaders of Repository information, along with storage companies.

Practitioners can make use of various IOTTA Repository traces to gain a better understanding of actual I/O storage operation activity within various environments and scenarios.  Traces can also be used as a basis for benchmarking and testing proposed solutions.

SNIA IOTTA TWG members receive a monthly report that shows the number and types (i.e., trace names) of the traces downloaded during the month, including the downloader region (e.g., Asia, Europe, North America). The report also includes company/institution names associated with the downloaders. More information on joining the IOTTA TWG is at http://iotta.snia.org/faqs/joinIOTTA.

Q: What is some of the latest information in the Repository?

A: In February 2024, we posted NVMe drive reliability traces collected by Alibaba. The collection includes both fail-stop and fail-slow data for a large drive population in Alibaba’s servers.

Q: What is the importance of these traces?

A: The authors of the associated USENIX ATC 2022 paper indicate that the Alibaba Fail-Stop dataset is the first large-scale public dataset on real-world operational data of NVMe SSD.  From their analysis of the dataset, they identified a series of major reliability changes in NVMe SSD.

In addition, the authors of the associated USENIX FAST 2023 paper indicate that the Alibaba Fail-Slow dataset is the first large-scale, clear-labeled public dataset on real-world operational traces aiming at fail-slow detection (i.e., where the drive continues to run but with poor performance). Based upon the dataset, the authors have provided a root cause analysis on fail-slow drives.

With the growing importance of NVMe SSDs in the data center, it is critical to understand the reliability of hardware in the cloud.  The Repository provides the traces download and also links to the papers and presentation videos that discuss these large-scale SSD reliability studies.

Q: What new activity would you like to see in the Repository?

A: We’d like to see more trace downloads for analysis.  Most downloads today are related to benchmarking and replay.  Trace activity could feed into a simulated computer system to test activities like failures.

We would also like to see more input of data related to tape storage. The Repository does not have much information on cold storage and multilevel storage between hot and cold storage.

Finally, we would like feedback on how people are using what they download – for analysis, reliability, benchmarks and other areas they have found the downloads useful. We also want to know what else you would like to be able to download.  You can contact us directly at iottachairs@snia.org.

Thanks for your time and the great information about the IOTTA Repository.  Learn more about the IOTTA Repository on their FAQ page.

2024 Year of the Summit Kicks Off – Meet us at MemCon

2023 was a great year for SNIA CMSI to meet with IT professionals and end users in “Summits” to discuss technologies, innovations, challenges, and solutions.  Our outreach at six industry events reached over 16,000 and we thank all who engaged with our CMSI members.

We are excited to continue a second “Year of the Summit” with a variety of opportunities to network and converse with you.  Our first networking event will take place March 26-27, 2024 at MemCon in Mountain View, CA.

MemCon 2024 focuses on systems design for the data centric era, working with data-intensive workloads, integrating emerging technologies, and overcoming data movement and management challenges. The agenda includes presentations and panels, featuring speakers from Meta, Microsoft, Netflix, Samsung, and Warner Brothers.   It’s the perfect event to discuss the integration of SNIA’s focus on developing global standards and delivering education on all technologies related to data.  SNIA and MemCon have prepared a video highlighting several of the key topics to be discussed.

MemCon 2024 Video Preview

At MemCon, SNIA CMSI member and SDXI Technical Work Group Chair Shyam Iyer of Dell will moderate a panel discussion on How are Memory Innovations Impacting the Total Cost of Ownership in Scaling-Up and Power Consumption , discussing impacts on hyperscalers, AI/ML compute, and cost/power.

SNIA Board member David McIntyre will participate in a panel on How are Increased Adoption of CXL, HBM, and Memory Protocol Expected to Change the Way Memory and Storage is Used and Assembled? , with insights on the markets and emerging memory innovations. The full MemCon agenda is here.

In the exhibit area, SNIA leaders will be on hand to demonstrate updates to the SNIA Persistent Memory Programming Workshop featuring new CXL® memory modules (get an early look at our Programming exercises here) and to provide a first look at a Smart Data Accelerator Interface (SDXI) specification implementation.  We’ll also provide updates on SNIA technical work on form factors like those used for CXL. We will feature a drawing for gift cards at the SNIA hosted coffee receptions and at the Tuesday evening networking reception.

SNIA colleagues and friends can register for MemCon with a 15% discount using code SNIA15.

And stay tuned for engaging with SNIA at upcoming events in 2024, including a return of the SNIA Compute, Memory, and Storage Summit in May 2024, August 2024 FMS-the Future of Memory and Storage; SNIA SDC in September, and SC24 in Atlanta in November 2024. We’ll discuss each of these in depth in our Year of the Summit blog series.

Emerging Memories Branch Out – a Q&A

Our recent SNIA Persistent Memory SIG webinar explored in depth the latest developments and futures of emerging memories – now found in multiple applications both as stand-alone chips and embedded into systems on chips. We got some great questions from our live audience, and our experts Arthur Sainio, Tom Coughlin, and Jim Handy have taken the time to answer them in depth in this blog. And if you missed the original live talk, watch the video and download the PDF here.

Q:  Do you expect Persistent Memory to eventually gain the speeds that exist today with DRAM?

A:  It appears that that has already happened with the hafnium ferroelectrics that SK Hynix and Micron have shown.  Ferroelectric memory is a very fast technology and with very fast write cycles there should be every reason for it to go that way. With the hooks that are in CXL™, , though, that shouldn’t be that much of a problem since it’s a transactional protocol. The reads, then, will probably rival DRAM speeds for MRAM and for resistive RAM (MRAM might get up to DRAM speeds with its writes too). In fact, there are technologies like spin-orbit torque and even voltage-controlled magnetic anisotropy that promise higher performance and also low write latency for MRAM technologies. I think that probably most applications are read intensive and so the read is the real place where the focus is, but it does look like we are going to get there.

Q:  Are all the new Memory technology protocols (electrically) compatible to DRAM interfaces like DDR4 or DDR5? If not, then shouldn’t those technologies have lower chances of adoption as they add dependency on custom in-memory controller?

A:  That’s just a logic problem.  There’s nothing innate about any memory technology that couples it tightly with any kind of a bus, and so because NOR Flash and SRAM are the easy targets so far, most emerging technologies have used a NOR flash or SRAM type interface.  However, in the future they could use DDR.  There’re some special twists because you don’t have to refresh emerging memory technologies. but you know in general they could use DDR.

But one of the beauties of CXL is that you put anything you want to with any kind of interface on the other side of CXL and CXL erases what the differences are. It moderates them so although they may have different performances it’s hidden behind the CXL network.  Then the burden goes on to the CXL controller designers to make sure that those emerging technologies, whether it’s MRAM or others, can be adopted behind that CXL protocol. My expectation is for there to be a few companies early on who provide CXL controllers that that do have some kind of a specialty interface on them whether it’s for MRAM or for Resistive RAM or something like that, and then eventually for them to move their way into the mainstream.  Another interesting thing about CXL is that we may even see a hierarchy of different memories within CXL itself which also includes as part of CXL including domain specific processors or accelerators that operate close to memory, and so there are very interesting opportunities there as well. If you can do processing close to memory you lower the amount of data you’re moving around and you’re saving a lot of power for the computing system.

Q: Emerging memory technologies have a byte-level direct access programming model, which is in contrast to block-based NAND Flash. Do you think this new programming model will eventually replace NAND Flash as it reduces the overhead and reduces the power of transferring Data?

A: It’s a question of cost and that’s something that was discussed very much in our webinar. If you haven’t got a cost that’s comparable to NAND Flash, then you can’t really displace it.  But as far as the interface is concerned, the NAND interface is incredibly clumsy. All of these technologies do have both byte interfaces rather than a block interface but also, they can write in place – they don’t need to have a pre-erased block to write into. That from a technical standpoint is a huge advantage and now it’s just a question of whether or not they can get the cost down – which means getting the volume up.

Q: Can you discuss the High Bandwidth Memory (HBM) trends? What about memories used with Graphic Processing Units (GPUs)?

A: That topic isn’t the subject of this webinar as this webinar is about emerging memory technologies. But, to comment, we don’t expect to see emerging memory technologies adopt an HBM interface anytime in the really near future because HBM does springboard off DRAM and, as we discussed on one of the slides, DRAM has a transition that we don’t know when it’s going to happen that it goes to another emerging memory technology.  We’ve put it into the early 2030s in our chart, but it could be much later than that and HBM won’t convert over to an emerging memory technology until long after that.

However, HBM involves stacking of chips and that ultimately could happen.  It’s a more expensive process right now –  a way of getting a lot of memory very close to a processor – and if you look at some of the NVIDIA applications for example,  this is an example of the Chiplet technology and HBM can play a role in those Chiplet technologies for GPUs..  That’s another area that’s going to be using emerging memories as well – in the Chiplets.  While we didn’t talk about that so much in this webinar, it is another place for emerging memories to be playing a role.

There’s one other advantage to using an emerging memory that we did not talk about: emerging memories don’t need refresh. As a matter of fact, none of the emerging memory technologies need refresh. More power is consumed by DRAM refreshing than by actual data accesses.  And so, if you can cut that out of it,  you might be able to stack more chips on top of each other and get even more performance, but we still wouldn’t see that as a reason for DRAM to be displaced early on in HBM and then later on in the mainstream DRAM market.  Although, if you’re doing all those refreshes there’s a fair amount of potential of heat generation by doing that, which may have packaging implications as well. So, there may be some niche areas in there which could be some of the first ways in which some of these emerging memories are potentially used for those kinds of applications, if the performance is good enough.

Q:  Why have some memory companies failed?  Apart from the cost/speed considerations you mention, what are the other minimum envelope features that a new emerging memory should have? Is capacity (I heard 32Gbit multiple times) one of those criteria?

A: Shipping a product is probably the single most important activity for success. Companies don’t have to make a discrete or standalone SRAM or emerging memory chip but what they need to do is have their technology be adopted by somebody who is shipping something if they’re not going to ship it themselves.  That’s what we see in the embedded market as a good path for emerging memory IP: To get used and to build up volume. And as the volume and comfort with manufacturing those memories increase, it opens up the possibility down the road of lower costs with higher volume standalone memory as well.

Q:  What are the trends in DRAM interfaces?  Would you discuss CXL’s role in enabling composable systems with DRAM pooling?

A:  CXL, especially CXL 3.0, has particularly pointed at pooling. Pooling is going to be an extremely important development in memory with CXL, and it’s one of the reasons why CXL probably will proliferate. It allows you to be able to allocate memory which is not attached to particular server CPUs and therefore to make more efficient and effective use of those memories. We mentioned this earlier when we said that right now DRAM is that memory with some NAND Flash products out there too. But this could expand into other memory technologies behind CXL within the CXL pool as well as accelerators (domain specific processors) that do some operations closer to where the memory lives. So, we think there’s a lot of possibilities in that pooling for the development and growth of emerging memories as well as conventional memories.

Q: Do you think molecular-based technologies (DNA or others) can emerge in the coming years as an alternative to some of the semiconductor-based memories?

A: DNA and other memory technologies are in a relatively early stage but there are people who are making fairly aggressive plans on what they can do with those technologies. We think the initial market for those molecular memories are not in this high performance memory application; but especially with DNA, the potential density of storage and the fact that you can make lots of copies of content by using genetic genomic processes makes them very attractive potentially for archiving applications.  The things we’ve seen are mostly in those areas because of the performance characteristics. But the potential density that they’re looking at is actually aimed at that lower part of the market, so it has to be very, very cost effective to be able to do that, but the possibilities are there.  But again, as with the emerging high performance memories, you still have the economies of scale you have to deal with – if you can’t scale it fast enough the cost won’t go down enough that will actually will be able to compete in those areas. So it faces somewhat similar challenges, though in a different part of the market.

Earlier in the webcast, we said when showing the orb chart, that for something to fit into the computing storage hierarchy it has to be cheaper than the next faster technology and faster than the next cheaper technology. DNA is not a very fast technology and so that automatically says it has to be really cheap for it to catch on and that puts it in a very different realm than the emerging memories that we’re talking about here. On the other hand, you never know what someone’s going to discover, but right now the industry doesn’t know how to make fast molecular memories.

Q:  What is your intuition on how tomorrow’s highly dense memories might impact non-load/store processing elements such as AI accelerators? As model sizes continue to grow and energy density becomes more of an issue, it would seem like emerging memories could thrive in this type of environment. Your thoughts?

A:  Any memory would thrive in an environment where there was an unbridled thirst for memory. as artificial intelligence (AI) currently is. But AI is undergoing some pretty rapid changes, not only in the number of the parameters that are examined, but also in the models that are being used for it. We recently read a paper that was written by Apple* where they actually found ways of winnowing down the data that was used for a large language model into something that would fit into an Apple MacBook Pro M2 and they were able to get good performance by doing that.  They really accelerated things by ignoring data that didn’t really make any difference. So, if you take that kind of an approach and say: “Okay.  If those guys keep working on that problem that way, and they take it to the extreme, then you might not need all that much memory after all.”  But still, if memory were free, I’m sure that there’d be a ton of it out there and that is just a question of whether or not these memories can get cheaper than DRAM so that they can look like they’re free compared to what things look like today.

There are three interesting elements of this:  First, CXL, in addition allowing mixing of memory types, again allows you to put in those domain specific processors as well close to the memory. Perhaps those can do some of the processing that’s part of the model, in which case it would lower the energy consumption. The other thing it supports is different computing models than what we traditionally use. Of course there is quantum computing, but there also is something called neural networks which actually use the memory as a matrix multiplier, and those are using these emerging memories for that technology which could be used for AI applications.  The other thing that’s sort of hidden behind this is that spin tunnelling is changing processing itself in that right now everything is current-based, but there’s work going on in spintronic based devices that instead of using current would use the spin of electrons for moving data around, in which case we can avoid resistive heating and our processing could run a lot cooler and use less energy to do so.  So, there’s a lot of interesting things that are kind of buried in the different technologies being used for these emerging memories that actually could have even greater implications on the development of computing beyond just the memory application themselves.  And to elaborate on spintronics, we’re talking about logic and not about spin memory – using spins rather than that of charge which is current.

Q:  Flash has an endurance issue (maximum number of writes before it fails). In your opinion, what is the minimum acceptable endurance (number of writes) that an emerging memory should support?

It’s amazing how many techniques have fallen into place since wear was an issue in flash SSDs.  Today’s software understands which loads have high write levels and which don’t, and different SSDs can be used to handle the two different kinds of load.  On the SSD side, flash endurance has continually degraded with the adoption of MLC, TLC, and QLC, and is sometimes measured in the hundreds of cycles.  What this implies is that any emerging memory can get by with an equally low endurance as long as it’s put behind the right controller.

In high-speed environments this isn’t a solution, though, since controllers add latency, so “Near Memory” (the memory tied directly to the processor’s memory bus) will need to have higher endurance.  Still, an area that can help to accommodate that is the practice of putting code into memories that have low endurance and data into higher-endurance memory (which today would be DRAM).  Since emerging memories can provide more bits at a lower cost and power than DRAM, the write load to the code space should be lower, since pages will be swapped in and out more frequently.  The endurance requirements will depend on this swapping, and I would guess that the lowest-acceptable level would be in the tens of thousands of cycles.

Q: It seems that persistent memory is more of an enterprise benefit rather than a consumer benefit. And consumer acceptance helps the advancement and cost scaling issues. Do you agree? I use SSDs as an example. Once consumers started using them, the advancement and prices came down greatly.

Anything that drives increased volume will help.  In most cases any change to large-scale computing works its way down to the PC, so this should happen in time here, too. But today there’s a growing amount of MRAM use in personal fitness monitors, and this will help drive costs down, so initial demand will not exclusively come from enterprise computing. At the same time, the IBM FlashDrive that we mentioned uses MRAM, too, so both enterprise and consumer are already working to simultaneously grow consumption.

Q: The CXL diagram (slide 22 in the PDF) has 2 CXL switches between the CPUs and the memory. How much latency do you expect the switches to add, and how does that change where CXL fits on the array of memory choices from a performance standpoint?

The CXL delay goals are very aggressive, but I am not sure that an exact number has been specified.  It’s on the order of 70ns per “Hop,” which can be understood as the delay of going through a switch or a controller. Naturally, software will evolve to work with this, and will move data that has high bandwidth requirements but is less latency-sensitive to more remote areas, while managing the more latency-sensitive data to near memory.

Q: Where can I learn more about the topic of Emerging Memories?

Here are some resources to review

 

* LLM in a Flash: Efficient Large Language Model Inference with Limited Memory, Kevin Avizalideh, et. al.,             arXiv:2312.11514 [cs.CL]

Open Standards Featured at FMS 2023

SNIA welcomes colleagues to join them at the upcoming Flash Memory Summit, August 8-10, 2023 in Santa Clara CA.

SNIA is pleased to join standards organizations CXL Consortium™ (CXL™), PCI-SIG®, and Universal Chiplet Interconnect Express™ (UCIe™) in an Open Standards Pavilion, Booth #725, in the Exhibit Hall.  CMSI will feature SNIA member companies in a computational storage cross industry demo by Intel, MINIO, and Solidigm and a Data Filtering demo by ScaleFlux; a software memory tiering demo by VMware; a persistent memory workshop and hackathon; and the latest on SSD form factors E1 and E3 work by SNIA SFF TA Technical work group. SMI will showcase SNIA Swordfish® management of NVMe SSDs on Linux with demos by Intel Samsung and Solidigm.

CXL will discuss their advances in coherent connectivity.  PCI-SIG will feature their PCIe 5.0 architecture (32GT/s) and PCIe 6.0 (65GT/s) architectures and industry adoption and the upcoming PCIe 7.0 specification development (128GT/s).  UCIe will discuss their new open industry standard establishing a universal interconnect at the package-level.

SNIA STA Forum will also be in Booth #849 – learn more about the SCSI Trade Association joining SNIA.

These demonstrations and discussions will augment FMS program sessions in the SNIA-sponsored System Architecture Track on memory, computational storage, CXL, and UCIe standards.  A SNIA mainstage session on Wednesday August 9 at 2:10 pm will discuss Trends in Storage and Data: New Directions for Industry Standards.

SNIA colleagues and friends can receive a $100 discount off the 1-, 2-, or 3-day full conference registration by using code SNIA23.

Visit snia.org/fms to learn more about the exciting activities at FMS 2023 and join us there!

Your Questions Answered on Persistent Memory, CXL, and Memory Tiering

With the persistent memory ecosystem continuing to evolve with new interconnects like CXL™ and applications like memory tiering, our recent Persistent Memory, CXL, and Memory Tiering-Past, Present, and Future webinar was a big success.  If you missed it, watch it on demand HERE!

Many questions were answered live during the webinar, but we did not get to all of them.  Our moderator Jim Handy from Objective Analysis, and experts Andy Rudoff and Bhushan Chithur from Intel, David McIntyre from Samsung, and Sudhir Balasubramanian and Arvind Jagannath from VMware have taken the time to answer them in this blog. Happy reading!

Q: What features or support is required from a CXL capable endpoint to e.g. an accelerator to support the memory pooling? Any references?

A: You will have two interfaces, one for the primary memory accesses and one for the management of the pooling device. The primary memory interface is the .mem and the management interface will be via the .io or via a sideband interface. In addition you will need to implement a robust failure recovery mechanism since the blast radius is much larger with memory pooling.

Q: How do you recognize weak information security (in CXL)?

A: CXL has multiple features around security and there is considerable activity around this in the Consortium.  For specifics, please see the CXL Specification or send us a more specific question.

Q: If the system (e.g. x86 host) wants to deploy CXL memory (Type 3) now, is there any OS kernel configuration, BIO configuration to make the hardware run with VMWare (ESXi)? How easy or difficult this setup process?

A: A simple CXL Type 3 Memory Device providing volatile memory is typically configured by the pre-boot environment and reported to the OS along with any other main memory.  In this way, a platform that supports CXL Type 3 Memory can use it without any additional setup and can run an OS that contains no CXL support and the memory will appear as memory belonging to another NUMA code.  That said, using an OS that does support CXL enables more complex management, error handling, and more complex CXL devices.

Q: There was a question on ‘Hop” length. Would you clarify?

A: In the webinar around minute 48, it was stated that a Hop was 20ns, but this is not correct. A Hop is often spoken of as “Around 100ns.”  The Microsoft Azure Pond paper quantifies it four different ways, which range from 85ns to 280ns.

Q: Do we have any idea how much longer the latency will be?  

A: The language CXL folks use is “Hops.”   An address going into CXL is one Hop, and data coming back is another.  In a fabric it would be twice that, or four Hops.  The  latency for a Hop is somewhere around 100ns, although other latencies are accepted.

Q: For memory semantic SSD:  There appears to be a trend among 2LM device vendors to presume the host system will be capable of providing telemetry data for a device-side tiering mechanism to decide what data should be promoted and demoted.  Meanwhile, software vendors seem to be focused on the devices providing telemetry for a host-side tiering mechanism to tell the device where to move the memory.  What is your opinion on how and where tiering should be enforced for 2LM devices like a memory semantic SSD?

A: Tiering can be managed both by the host and within computational storage drives that could have an integrated compute function to manage local tiering- think edge applications.

Q: Re VM performance in Tiering: It appears you’re comparing the performance of 2 VM’s against 1.  It looked like the performance of each individual VM on the tiering system was slower than the DRAM only VM.  Can you explain why we should take the performance of 2 VMs against the 1 VM?  Is the proposal that we otherwise would have required those 2 VM’s to run on separate NUMA node, and now they’re running on the same NUMA node?

A: Here the use case was, lower TCO & increased capacity of memory along with aggregate performance of VM’s v/s running few VM’s on DRAM. In this use case, the DRAM per NUMA Node was 384GB, the Tier2 memory per NUMA node was 768GB. The VM RAM was 256GB.

In the DRAM only case, if we have to run business critical workloads e.g., Oracle with VM RAM=256GB,  we could only run 1 VM (256GB) per NUMA Node (DRAM=384GB), we cannot over-provision memory in the DRAM only case as every NUMA node has 384GB only. So potentially we could run 4 such VM’s (VM RAM=256Gb) in this case with NUMA node affinity set as we did in this use case OR if we don’t do NUMA node affinity, maybe 5 such VM’s without completely maxing out the server RAM.  Remember, we did NUMA node affinity in this use case to eliminate any cross NUMA latency.78

Now with Tier2 memory in the mix, each NUMA node has 384GB DRAM and 768GB Tier2 Memory, so theoretically one could run 16-17 such VM’s (VM RAM =256GB), hence we are able to increase resource maximization, run more workloads, increase transactions etc , so lower TCO, increased capacity and aggregate performance improvement.

Q: CXL is changing very fast, we have 3 protocol versions in 2 years, as a new consumer of CXL what are the top 3 advantages of adopting CXL right away v/s waiting for couple of more years?

A: All versions of CXL are backward compatible.  Users should have no problem using today’s CXL devices with newer versions of CXL, although they won’t be able to take advantage of any new features that are introduced after the hardware is deployed.

Q: (What is the) ideal when using agilex FPGAs as accelerators?

A: CXL 3.0 supports multiple accelerators via the CXL switching fabric. This is good for memory sharing across heterogeneous compute accelerators, including FPGAs.

Thanks again for your support of SNIA education, and we invite you to write askcmsi@snia.org for your ideas for future webinars and blogs!

It’s A Wrap – But Networking and Education Continue From Our C+M+S Summit!

Our 2023 SNIA Compute+Memory+Storage Summit was a success! The event featured 50 speakers in 40 sessions over two days. Over 25 SNIA member companies and alliance partners participated in creating content on computational storage, CXL™ memory, storage, security, and UCIe™. All presentations and videos are free to view at www.snia.org/cms-summit.

“For 2023, the Summit scope expanded to examine how the latest advances within and across compute, memory and storage technologies should be optimized and configured to meet the requirements of end customer applications and the developers that create them,” said David McIntyre, Co-Chair of the Summit.  “We invited our SNIA Alliance Partners Compute Express Link™ and Universal Chiplet Interconnect Express™ to contribute to a holistic view of application requirements and the infrastructure resources that are required to support them,” McIntyre continued.  “Their panel on the CXL device ecosystem and usage models and presentation on UCIe innovations at the package level along with three other sessions on CXL added great value to the event.”

Thirteen computational storage presentations covered what is happening in NVMe™ and SNIA to support computational storage devices and define new interfaces with computational storage APIs that work across different hardware architectures.  New applications for high performance data analytics, discussions of how to integrate computational storage into high performance computing designs, and new approaches to integrate compute, data and I/O acceleration closely with storage systems and data nodes were only a few of the topics covered.

“The rules by which the memory game is played are changing rapidly and we received great feedback on our nine presentations in this area,” said Willie Nelson, Co-Chair of the Summit.  “SNIA colleagues Jim Handy and Tom Coughlin always bring surprising conclusions and opportunities for SNIA members to keep abreast of new memory technologies, and their outlook was complimented by updates on SNIA standards on memory-to memory data movement and on JEDEC memory standards; presentations on thinking memory, fabric attached memory, and optimizing memory systems using simulations; a panel examining where the industry is going with persistent memory, and much more.”

Additional highlights included an EDSFF panel covering the latest SNIA specifications that support these form factors, sharing an overview of platforms that are EDSFF-enabled, and discussing the future for new product and application introductions; a discussion on NVMe as a cloud interface; and a computational storage detecting ransomware session.

New to the 2023 Summit – and continuing to get great views – was a “mini track” on Security, led by Eric Hibbard, chair of the SNIA Storage Security Technical Work Group with contributions from IEEE Security Work Group members, including presentations on cybersecurity, fine grain encryption, storage sanitization, and zero trust architecture.

Co-Chairs McIntyre and Nelson encourage everyone to check out the video playlist and send your feedback to askcmsi@snia.org. The “Year of the Summit” continues with networking opportunities at the upcoming SmartNIC Summit (June), Flash Memory Summit (August), and SNIA Storage Developer Conference (September).  Details on all these events and more are at the SNIA Event Calendar page.  See you soon!

50 Speakers Featured at the 2023 SNIA Compute+Memory+Storage Summit

SNIA’s Compute+Memory+Storage Summit is where architectures, solutions, and community come together. Our 2023 Summit – taking place virtually on April 11-12, 2023 – is the best example to date, featuring a stellar lineup of 50 speakers in 40 sessions covering topics including computational storage real-world applications, the future of memory, critical storage security issues, and the latest on SSD form factors, CXL™, and UCIe™.

“We’re excited to welcome executives, architects, developers, implementers, and users to our 11th annual Summit,” said David McIntyre, C+M+S Summit Co-Chair, and member of the SNIA Board of Directors.  “We’ve gathered the technology leaders to bring us the latest developments in compute, memory, storage, and security in our free online event.  We hope you will watch live to ask questions of our experts as they present, and check out those sessions you miss on-demand.”

Memory sessions begin with Watch Out – Memory’s Changing! where Jim Handy and Tom Coughlin will discuss the memory technologies vying for the designer’s attention, with CXL™ and UCIe™ poised to completely change the rules. Speakers will also cover thinking memory, optimizing memory using simulations, providing capacity and TCO to applications using software memory tiering, and fabric attached memory.

Compute sessions include Steven Yuan of StorageX discussing the Efficiency of Data Centric Computing, and presentations on the computational storage and compute market, big-disk computational storage arrays for data analytics, NVMe as a cloud interface, improving storage systems for simulation science with computational storage, and updates on SNIA and NVM Express work on computational storage standards.

CXL and UCIe will be featured with presentations on CXL 3.0 and Universal Compute Interface Express™ On-Package Innovation Slot for Compute, Memory, and Storage Applications.

The Summit will also dive into security with a introductory view of today’s storage security landscape and additional sessions on zero trust architecture, storage sanitization, encryption, and cyber recovery and resilience.

For 2023, the Summit is delighted to present three panels – one on Exploring the Compute Express Link™ (CXL™) Device Ecosystem and Usage Models moderated by Kurtis Bowman of the CXL Consortium, one on Persistent Memory Trends moderated by Dave Eggleston of Microchip, and one on Form Factor Updates, moderated by Cameron Brett of the SNIA SSD Special Interest Group.

We will also feature the popular SNIA Birds-of-a-Feather sessions. On Tuesday April 11 at 4:00 pm PDT/7:00 pm EDT, you can join to discuss the latest compute, memory, and storage developments, and on Wednesday April at 3:00 pm PDT/6:00 pm EDT, we’ll be talking about memory advances.

Learn more in our Summit preview video, check out the agenda, and register for free to access our Summit platform!

“Year of the Summit” Kicks Off with Live and Virtual Events

For 11 years, SNIA Compute, Memory and Storage Initiative (CMSI) has presented a Summit featuring industry leaders speaking on the key topics of the day.  In the early years, it was persistent memory-focused, educating audiences on the benefits and uses of persistent memory.  In 2020 it expanded to a Persistent Memory+Computational Storage Summit, examining that new technology, its architecture, and use cases.

Now in 2023, the Summit is expanding again to focus on compute, memory, and storage.  In fact, we’re calling 2023 the Year of the Summit – a year to get back to meeting in person and offering a variety of ways to listen to leaders, learn about technology, and network to discuss innovations, challenges, solutions, and futures.

We’re delighted that our first event of the Year of the Summit is a networking event at MemCon, taking place March 28-29 at the Computer History Museum in Mountain View CA.

At MemCon, SNIA CMSI member and IEEE President elect Tom Coughlin of Coughlin Associates will moderate a panel discussion on Compute, Memory, and Storage Technology Trends for the Application Developer.  Panel members Debendra Das Sharma of Intel and the CXL™ Consortium, David McIntyre of Samsung and the SNIA Board of Directors, Arthur Sainio of SMART Modular and the SNIA Persistent Memory Special Interest Group, and Arvind Jaganath of VMware and SNIA CMSI will examine how applications and solutions available today offer ways to address enterprise and cloud provider challenges – and they’ll provide a look to the future.

SNIA leaders will be on hand to discuss work in computational storage, smart data acceleration interface (SDXI), SSD form factor advances, and persistent memory trends.  Share a libation or two at the SNIA hosted networking reception on Tuesday evening, March 28.

This inaugural MemCon event is perfect to start the conversation, as it focuses on the intersection between systems design, memory innovation (emerging memories, storage & CXL) and other enabling technologies. SNIA colleagues and friends can register for MemCon with a 15% discount using code SNIA15.

April 2023 Networking!

We will continue the Year with a newly expanded SNIA Compute+Memory+Storage Summit coming up April 11-12 as a virtual event.  Complimentary registration is now open for a stellar lineup of speakers, including Stephen Bates of Huawei, Debendra Das Sharma of  Universal Chiplet Interconnect Express™, Jim Handy of Objective Analysis, Shyam Iyer of Dell, Bill Martin of Samsung, Jake Oshins of Microsoft, Andy Rudoff of Intel, Andy Walls of IBM, and Steven Yuan of StorageX.

Summit topics include Memory’s Headed for Change, High Performance Data Analytics, CXL 3.0, Detecting Ransomware, Meeting Scaling Challenges, Open Standards for Innovation at the Package Level, and Standardizing Memory to Memory Data Movement. Great panel discussions are on tap as well.  Kurt Lender of the CXL Consortium will lead a discussion on Exploring the CXL Device Ecosystem and Usage Models, Dave Eggleston of Microchip will lead a panel with Samsung and SMART Modular on Persistent Memory Trends, and Cameron Brett of KIOXIA will lead a SSD Form Factors Update.   More details at www.snia.org/cms-summit.

Later in 2023…

Opportunities for networking will continue throughout 2023. We look forward to seeing you at the SmartNIC Summit (June 13-15), Flash Memory Summit (August 8-10), SNIA Storage Developer Conference (September 18-21), OCP Global Summit (October 17-19), and SC23 (November 12-17). Details on SNIA participation coming soon!

Is EDSFF Taking Center Stage? We Answer Your Questions!

Enterprise and Data Center Form Factor (EDSFF) technologies have come a long way since our 2020 SNIA CMSI webinar on the topic.  While that webinar still provides an outstanding framework for understanding – and SNIA’s popular SSD Form Factors page gives the latest on the E1 and E3 specifications – SNIA Solid State Drive Special Interest Group co-chairs Cameron Brett and Jonmichael Hands joined to provide the latest updates at our live webcast: EDSFF Taking Center Stage in the Data Center.  We had some great questions from our live audience, so our experts have taken the time to answer them in this this blog.

Q: What does the EDSFF roadmap look like? When will we see PCIe® Gen5 NVMe™, 1.2, 2.0 CXL cx devices?

As the form factors come out into the market, we anticipate that there will be feature updates and smaller additions to the existing specifications like SFF TA 1008 and SFF TA 1023.  There may also be changes around defining LEDs and stack updates.  The EDSFF specifications, however, are mature and we have seen validation and support on the connector and how it works at higher interface speeds. You now have platforms, backplanes, and chassis to support these form factors in the marketplace.  Going forward, we may see integration with other device types like GPUs, support of new platforms, and alignment with PCIe Gen 5.  Regarding CXL, we see the buzz, and having this form factor be the kind of vehicle for CXL will have a huge momentum. 

Q:  I’m looking for thoughts on recent comments I read about PCIe5 NVMe drives likely needing/benefitting from larger form-factors (like 25mm wide vs 22) for cooling considerations. With mass market price optimizations, what is the likelihood that client compute will need to transition away from existing M.2 (esp 2280) form factors in the coming years and will that be a shared form-factor shared with server compute (as has been the case with 5.25″,3.5″,2.5″ drives)?

We are big fans of EDSFF being placed on reference platforms for OEMs and motherboard makers. Enterprise storage support would be advantageous on the desktop.  At the recent OCP Global Summit, there was discussion on Gen 5 specifications and M.2 and U.2. With the increased demands for power and bandwidth, we think if you want more performance you will need to move to a different form factor, and EDSFF makes sense. 

Q:  On E1.S vs E3.S market dominance, can you refer to their support on dual-port modules? Some traditional storage server designs favor E3.S because of the dual port configuration. More modern storage designs do not rely on dual port modules, and therefore prefer E1.S. Do you agree to this correlation ? How will this affect the predictions on market share?

A:  There is some confusion about the specification support versus what vendors support and what customers are demanding.  The EDSFF specifications share a common pin out and connection specifications.  If a manufacturer wishes to support the dual port functionality, they can do so now.  Hyperscalers are now using E1.S in compute designs and may use E3 for their high availability enterprise storage requirements.  Our webcast showed the forecast from Forward Insights on larger shipments of E3 further out in time, reflecting the transition away from 2.5-inch to E3 as server and storage OEMs transition their backplanes.

Q:  Have you investigated enabling conduction cooling of E1.S and E3.S to a water cooled cold plate? If not, is it of interest?

OCP Global Summit featured a presentation from Intel about immersion cooling with a focus on the sustainability aspect as you can get your power usage effectiveness (PUE) down further by eliminating the fans in system design while increasing cooling.  There doesn’t seem to be anything eliminating the use of EDSFF drives for immersion cooling. New CPUs have heat pipes, and new OEM designs have up to 36 drives in a 2U chassis.  How do you cool that?  Many folks are talking about cooling in the data center, and we’ll just need to wait to see what happens!

Illustration of Dell PowerEdge AMD Genoa Servers with 32 E3.S SSD bays

Thanks again for your interest in SNIA and Enterprise and Data Center SSD Form Factors.  We invite you to visit our SSD Form Factor page where we have videos, white papers, and charts explaining the many different SSD sizes and formats in a variety of form factors. You may also wish to check out a recent article from Storage Review which discusses an E3.S implementation.